Statements (45)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Electronic component
Packaging technology |
| gptkbp:abbreviation |
gptkb:Multi-Chip_Module
|
| gptkbp:alternativeTo |
gptkb:System_in_Package_(SiP)
System on Chip (SoC) |
| gptkbp:assembledOn |
Substrate
|
| gptkbp:contains |
Multiple integrated circuits
Semiconductor dies |
| gptkbp:developedBy |
1980s
|
| gptkbp:enables |
Lower power consumption
Cost reduction in high-volume production Faster signal transmission High-density packaging Higher integration density Improved thermal management Miniaturization of electronics Reduced electromagnetic interference Shorter signal paths |
| gptkbp:hasType |
MCM-C
MCM-D MCM-L |
| https://www.w3.org/2000/01/rdf-schema#label |
Multi-Chip Module (MCM)
|
| gptkbp:improves |
gptkb:performance
Reliability |
| gptkbp:MCM-C |
uses ceramic substrate
|
| gptkbp:MCM-D |
uses deposited dielectric substrate
|
| gptkbp:MCM-L |
uses laminate substrate
|
| gptkbp:reduces |
Weight
Size Interconnect length |
| gptkbp:relatedTo |
gptkb:Flip_chip
Land Grid Array Chip carrier Hybrid integrated circuit |
| gptkbp:usedIn |
gptkb:consumer_electronics
Telecommunications Microelectronics Automotive electronics Integrated circuits Military electronics Aerospace electronics |
| gptkbp:bfsParent |
gptkb:POP_(package_on_package)
gptkb:IBM_POWER6 gptkb:System_in_Package_(SiP) |
| gptkbp:bfsLayer |
6
|