Statements (62)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Surface-mount packaging
surface-mount packaging technology integrated circuit packaging technology |
| gptkbp:abbreviation |
gptkb:LGA
BGA |
| gptkbp:advantage |
improved electrical performance
better electrical performance higher pin density better heat dissipation difficult to inspect solder joints requires X-ray inspection smaller package size difficult to rework better thermal performance higher pin density possible reduced risk of bent pins on chip |
| gptkbp:alternativeName |
Ball_Grid_Array
Ball_Grid_Array_package Ball_grid_array |
| gptkbp:category |
gptkb:microprocessor
electronic packaging |
| gptkbp:component |
printed circuit boards
printed circuit board assembly |
| gptkbp:connectorType |
solder balls
|
| gptkbp:contactWith |
flat contacts
|
| gptkbp:contrastsWith |
Land Grid Array
Pin Grid Array |
| gptkbp:feature |
array of solder balls
bottom-mounted connections high pin density contacts on bottom of package no pins on package socket has pins bottom of package solder balls arranged in grid |
| gptkbp:introducedIn |
1990s
early 2000s |
| gptkbp:relatedTo |
gptkb:Socket_AM5
Socket 1151 Socket 775 |
| gptkbp:replacedBy |
dual in-line package
pin grid array |
| gptkbp:requires |
reflow soldering
|
| gptkbp:type |
surface-mount
|
| gptkbp:used_in |
gptkb:AMD
gptkb:Intel embedded systems server CPUs desktop CPUs |
| gptkbp:usedFor |
microprocessors
integrated circuits memory chips mounting integrated circuits |
| gptkbp:usedIn |
microprocessors
FPGAs memory chips |
| gptkbp:bfsParent |
gptkb:LGA_1155
gptkb:LGA_1700 gptkb:LGA_1156 gptkb:LGA_1150 gptkb:LGA_2066 |
| gptkbp:bfsLayer |
5
|