Statements (50)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
thermal management challenges
complex assembly process flexibility in sourcing memory and logic higher cost than single package improved board space efficiency simplified supply chain |
| gptkbp:allows |
mix-and-match of memory and logic chips
separate testing of logic and memory packages |
| gptkbp:alternativeTo |
gptkb:Multi-Chip_Module_(MCM)
gptkb:System_in_Package_(SiP) |
| gptkbp:assembly |
gptkb:surface_mount_technology_(SMT)
|
| gptkbp:commonStack |
logic chip on bottom, memory chip on top
|
| gptkbp:component |
stacked package
surface-mount technology |
| gptkbp:connectorType |
micro bumps
solder balls |
| gptkbp:enables |
modular design
lower power consumption faster time to market high-density integration higher bandwidth between logic and memory higher performance independent procurement of memory and logic lower electromagnetic interference reduced footprint on PCB reduced signal delay shorter signal paths vertical stacking of integrated circuits |
| https://www.w3.org/2000/01/rdf-schema#label |
Package on Package (PoP)
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:marketedAs |
major semiconductor companies
|
| gptkbp:product |
gptkb:Apple_A-series_SoC_with_PoP_memory
gptkb:Qualcomm_Snapdragon_with_PoP_memory gptkb:Samsung_Exynos_SoC_with_PoP_memory |
| gptkbp:relatedTo |
gptkb:3D_IC
gptkb:Ball_Grid_Array_(BGA) gptkb:Through-Silicon_Via_(TSV) flip chip wire bonding |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedFor |
application processors
mobile SoCs DRAM stacking NAND flash stacking |
| gptkbp:usedIn |
smartphones
tablets mobile devices |
| gptkbp:bfsParent |
gptkb:Apple_A8
|
| gptkbp:bfsLayer |
6
|