Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
improves electrical performance
saves board space |
| gptkbp:allows |
separate logic and memory packages to be stacked
|
| gptkbp:alternativeTo |
gptkb:Multi-Chip_Module_(MCM)
gptkb:System_in_Package_(SiP) |
| gptkbp:component |
logic package
memory package |
| gptkbp:enables |
independent testing of memory and logic packages
vertical stacking of integrated circuits |
| gptkbp:feature |
modular design
reduced electromagnetic interference shorter signal paths |
| https://www.w3.org/2000/01/rdf-schema#label |
PoP (Package on Package)
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedFor |
ARM-based processors
mobile application processors |
| gptkbp:usedIn |
smartphones
tablets mobile devices |
| gptkbp:bfsParent |
gptkb:Apple_A4
gptkb:Apple_A7 |
| gptkbp:bfsLayer |
6
|