Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
improves electrical performance
saves board space |
| gptkbp:allows |
separate logic and memory packages
|
| gptkbp:alternativeTo |
gptkb:Multi-Chip_Module_(MCM)
gptkb:System_in_Package_(SiP) |
| gptkbp:component |
surface-mount technology
|
| gptkbp:enables |
high-density packaging
independent testing of memory and logic packages vertical stacking of integrated circuits |
| https://www.w3.org/2000/01/rdf-schema#label |
POP (package on package)
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:relatedTo |
gptkb:Ball_Grid_Array_(BGA)
flip chip wire bonding |
| gptkbp:usedBy |
gptkb:Qualcomm
gptkb:Samsung gptkb:MediaTek |
| gptkbp:usedIn |
smartphones
tablets mobile devices |
| gptkbp:bfsParent |
gptkb:Apple_A6X
|
| gptkbp:bfsLayer |
5
|