Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:alsoKnownAs |
controlled collapse chip connection
|
| gptkbp:appliesTo |
printed circuit boards
ceramic substrates silicon substrates |
| gptkbp:contrastsWith |
wire bonding
|
| gptkbp:developedBy |
gptkb:IBM
|
| gptkbp:enables |
better electrical performance
improved heat dissipation smaller package size high-density interconnects higher speed operation lower inductance connections |
| https://www.w3.org/2000/01/rdf-schema#label |
Flip chip
|
| gptkbp:introducedIn |
1960s
|
| gptkbp:mountingMethod |
face-down
|
| gptkbp:requires |
underfill material
|
| gptkbp:usedIn |
microprocessors
integrated circuits MEMS devices |
| gptkbp:uses |
solder bumps
|
| gptkbp:bfsParent |
gptkb:Multi-Chip_Module_(MCM)
|
| gptkbp:bfsLayer |
7
|