Statements (57)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic packaging technology
|
| gptkbp:advantage |
improved performance
lower power consumption smaller footprint faster time to market shorter signal paths |
| gptkbp:alsoKnownAs |
gptkb:SiP
|
| gptkbp:application |
gptkb:consumer_electronics
IoT devices wearables medical devices mobile devices automotive electronics |
| gptkbp:component |
gptkb:MEMS
sensors integrated circuits power management ICs memory chips passive components substrate logic chips solder balls RF modules active components encapsulant flip-chip interconnects wire bonds |
| gptkbp:contrastsWith |
gptkb:Multi-Chip_Module_(MCM)
Printed Circuit Board (PCB) assembly System on Chip (SoC) |
| gptkbp:enables |
integration of multiple ICs
integration of MEMS integration of RF modules integration of logic chips integration of memory chips integration of passive components integration of power management ICs integration of sensors |
| https://www.w3.org/2000/01/rdf-schema#label |
System in Package (SiP)
|
| gptkbp:integratesWith |
vertical stacking
2.5D integration 3D integration side-by-side placement |
| gptkbp:manufacturer |
gptkb:ASE_Group
gptkb:Amkor_Technology gptkb:TSMC gptkb:JCET_Group STATS ChipPAC |
| gptkbp:relatedTo |
advanced packaging
heterogeneous integration chiplet technology embedded die packaging fan-out wafer-level packaging |
| gptkbp:standardizedBy |
JEDEC JEP95
|
| gptkbp:usedIn |
semiconductor industry
|
| gptkbp:bfsParent |
gptkb:Apple_S1
|
| gptkbp:bfsLayer |
5
|