Statements (31)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:abbreviation |
gptkb:MCM
|
| gptkbp:advantage |
higher cost
complex manufacturing lower power consumption improved electrical performance reduced size thermal management challenges |
| gptkbp:application |
gptkb:consumer_electronics
telecommunications military electronics |
| gptkbp:component |
packaging
|
| gptkbp:contains |
substrate
interconnects multiple semiconductor dies |
| gptkbp:developedBy |
1980s
|
| gptkbp:enables |
improved performance
higher density packaging integration of multiple ICs reduction of interconnect length |
| https://www.w3.org/2000/01/rdf-schema#label |
Multi-Chip Module
|
| gptkbp:manufacturer |
semiconductor companies
|
| gptkbp:relatedTo |
gptkb:microprocessor
gptkb:Chip-on-board System in Package |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
high-performance computing
microelectronics integrated circuits |
| gptkbp:bfsParent |
gptkb:MCM
|
| gptkbp:bfsLayer |
6
|