Statements (36)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic packaging technology
|
| gptkbp:advantage |
improved electrical performance
higher pin density better heat dissipation difficult to inspect solder joints requires X-ray inspection requires precise reflow soldering |
| gptkbp:commonIn |
gptkb:consumer_electronics
industrial equipment computers |
| gptkbp:connectorType |
solder balls
|
| gptkbp:contrastsWith |
gptkb:DIP_packages
gptkb:QFP_packages |
| gptkbp:explores |
X-ray imaging
|
| gptkbp:feature |
array of solder balls
bottom-mounted connections |
| gptkbp:hasVariant |
gptkb:CBGA_(Ceramic_BGA)
gptkb:CSP_(Chip_Scale_Package) gptkb:FCBGA_(Flip-Chip_BGA) gptkb:PBGA_(Plastic_BGA) gptkb:TBGA_(Tape_BGA) gptkb:microBGA |
| https://www.w3.org/2000/01/rdf-schema#label |
BGA packages
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:replacedBy |
lead-frame packages
|
| gptkbp:requires |
reflow soldering process
|
| gptkbp:standsFor |
gptkb:Ball_Grid_Array_packages
|
| gptkbp:type |
surface-mount packaging
|
| gptkbp:usedFor |
high-performance applications
high pin count devices high-speed circuits |
| gptkbp:usedIn |
microprocessors
integrated circuits memory chips |
| gptkbp:bfsParent |
gptkb:Infineon_XMC
|
| gptkbp:bfsLayer |
6
|