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gptkbp:instanceOf
|
gptkb:electronic_packaging_technology
|
|
gptkbp:advantage
|
improved electrical performance
higher pin density
better heat dissipation
difficult to inspect solder joints
requires X-ray inspection
requires precise reflow soldering
|
|
gptkbp:commonIn
|
gptkb:consumer_electronics
gptkb:industrial_equipment
computers
|
|
gptkbp:connectorType
|
solder balls
|
|
gptkbp:contrastsWith
|
gptkb:DIP_packages
gptkb:QFP_packages
|
|
gptkbp:explores
|
X-ray imaging
|
|
gptkbp:feature
|
array of solder balls
bottom-mounted connections
|
|
gptkbp:hasVariant
|
gptkb:CBGA_(Ceramic_BGA)
gptkb:CSP_(Chip_Scale_Package)
gptkb:FCBGA_(Flip-Chip_BGA)
gptkb:PBGA_(Plastic_BGA)
gptkb:TBGA_(Tape_BGA)
gptkb:microBGA
|
|
gptkbp:introducedIn
|
1990s
|
|
gptkbp:replacedBy
|
lead-frame packages
|
|
gptkbp:requires
|
reflow soldering process
|
|
gptkbp:standsFor
|
gptkb:Ball_Grid_Array_packages
|
|
gptkbp:type
|
gptkb:surface-mount_packaging
|
|
gptkbp:usedFor
|
high-performance applications
high pin count devices
high-speed circuits
|
|
gptkbp:usedIn
|
microprocessors
integrated circuits
memory chips
|
|
gptkbp:bfsParent
|
gptkb:Infineon_XMC
|
|
gptkbp:bfsLayer
|
6
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
BGA packages
|