Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
higher cost
better heat dissipation more brittle than plastic BGA reliable electrical performance |
| gptkbp:contrastsWith |
Plastic BGA
|
| gptkbp:feature |
high mechanical strength
high thermal conductivity suitable for harsh environments |
| gptkbp:fullName |
Ceramic Ball Grid Array
|
| gptkbp:game |
solder balls
|
| https://www.w3.org/2000/01/rdf-schema#label |
CBGA (Ceramic BGA)
|
| gptkbp:substrate |
gptkb:ceramics
|
| gptkbp:type |
BGA
surface-mount |
| gptkbp:usedFor |
microprocessors
FPGAs high-reliability electronics |
| gptkbp:usedIn |
telecommunications
aerospace electronics military electronics |
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|