Statements (29)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
better heat dissipation
shorter electrical path |
| gptkbp:component |
laptops
mobile devices servers |
| gptkbp:contrastsWith |
wire-bond BGA
|
| gptkbp:feature |
solder balls on underside
good electrical performance good thermal performance flip-chip die attachment fine pitch capability high input/output density multi-layer substrate underfill material used |
| https://www.w3.org/2000/01/rdf-schema#label |
FCBGA (Flip-Chip BGA)
|
| gptkbp:relatedTo |
gptkb:BGA_(Ball_Grid_Array)
gptkb:CSP_(Chip_Scale_Package) FCBGA substrate |
| gptkbp:standsFor |
Flip-Chip Ball Grid Array
|
| gptkbp:type |
surface-mount technology
|
| gptkbp:usedBy |
gptkb:AMD
gptkb:NVIDIA gptkb:Intel |
| gptkbp:usedIn |
microprocessors
integrated circuits graphics processing units |
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|