Statements (19)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
good thermal performance
high input/output density |
| gptkbp:application |
microprocessors
ASICs memory chips |
| gptkbp:component |
solder balls
silicon die polyimide tape |
| gptkbp:feature |
gptkb:ball_grid_array
uses flexible tape substrate |
| https://www.w3.org/2000/01/rdf-schema#label |
TBGA (Tape BGA)
|
| gptkbp:relatedTo |
gptkb:CBGA_(Ceramic_BGA)
gptkb:PBGA_(Plastic_BGA) |
| gptkbp:standsFor |
Tape Ball Grid Array
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedIn |
semiconductor devices
|
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|