Statements (22)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
good thermal performance
cost-effective compared to ceramic BGA high pin count capability |
| gptkbp:alternativeTo |
ceramic BGA
|
| gptkbp:application |
microprocessors
ASICs memory devices |
| gptkbp:component |
printed circuit boards (PCBs)
|
| gptkbp:feature |
solder balls on underside
array of solder balls low profile molded plastic substrate |
| https://www.w3.org/2000/01/rdf-schema#label |
PBGA (Plastic BGA)
|
| gptkbp:material |
gptkb:plastic
|
| gptkbp:mountingMethod |
reflow soldering
|
| gptkbp:standsFor |
Plastic Ball Grid Array
|
| gptkbp:type |
gptkb:BGA_(Ball_Grid_Array)
|
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
semiconductor devices
|
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|