Statements (29)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
good for automated assembly
fragile leads difficult manual soldering |
| gptkbp:hasApplication |
gptkb:consumer_electronics
industrial electronics |
| gptkbp:hasLeadType |
gull wing
|
| gptkbp:hasPinCountRange |
32 to 304
|
| gptkbp:hasPinsOn |
all four sides
|
| gptkbp:hasPitch |
0.4 mm to 1.0 mm
|
| gptkbp:hasVariant |
gptkb:LQFP
TQFP PQFP |
| https://www.w3.org/2000/01/rdf-schema#label |
QFP packages
|
| gptkbp:material |
gptkb:ceramics
gptkb:plastic |
| gptkbp:replacedBy |
gptkb:BGA_packages
|
| gptkbp:shape |
rectangular
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:standsFor |
gptkb:Quad_Flat_Package
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
microcontrollers
microprocessors ASICs FPGAs |
| gptkbp:bfsParent |
gptkb:BGA_packages
gptkb:TQFP_packages |
| gptkbp:bfsLayer |
7
|