Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
smaller footprint
better electrical performance improved heat dissipation |
| gptkbp:ballPitch |
0.5 mm
0.8 mm |
| gptkbp:developedBy |
gptkb:Intel
|
| gptkbp:feature |
compact size
high pin count array of solder balls |
| gptkbp:fullName |
micro Ball Grid Array
|
| gptkbp:game |
solder
|
| https://www.w3.org/2000/01/rdf-schema#label |
microBGA
|
| gptkbp:relatedTo |
gptkb:CSP
BGA |
| gptkbp:type |
surface-mount
chip-scale package |
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
embedded systems
mobile devices memory chips |
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|