Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic component package
|
| gptkbp:abbreviation |
BGA
|
| gptkbp:advantage |
improved electrical performance
higher pin density difficult to inspect solder joints requires X-ray inspection difficult to rework better thermal performance |
| gptkbp:alternativeTo |
Leadless Chip Carrier
|
| gptkbp:assembly |
pick and place
reflow soldering |
| gptkbp:feature |
compact size
surface-mount technology array of solder balls high I/O count bottom side solder balls good heat dissipation low inductance connections no leads on package sides |
| https://www.w3.org/2000/01/rdf-schema#label |
Ball Grid Array packages
|
| gptkbp:inspectionBody |
X-ray imaging
electrical testing |
| gptkbp:introducedIn |
1990s
|
| gptkbp:mountingMethod |
solder reflow
|
| gptkbp:packageMaterial |
gptkb:ceramics
gptkb:plastic tape |
| gptkbp:relatedTo |
gptkb:Dual_In-line_Package
gptkb:Chip_Scale_Package Land Grid Array |
| gptkbp:replacedBy |
gptkb:Quad_Flat_Package
Pin Grid Array |
| gptkbp:reworkMethod |
hot air rework station
infrared rework station |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:type |
Ceramic Ball Grid Array
Micro Ball Grid Array Plastic Ball Grid Array Tape Ball Grid Array |
| gptkbp:usedBy |
gptkb:Texas_Instruments
gptkb:AMD gptkb:NVIDIA gptkb:Intel gptkb:Xilinx gptkb:Altera |
| gptkbp:usedFor |
mounting integrated circuits
|
| gptkbp:usedIn |
microprocessors
FPGAs memory chips |
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|