Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor package
|
| gptkbp:abbreviation |
gptkb:Chip_Scale_Package
|
| gptkbp:contrastsWith |
gptkb:BGA_(Ball_Grid_Array)
QFP (Quad Flat Package) |
| gptkbp:feature |
improved performance
surface-mount technology reduced package size lower cost for high volume better heat dissipation lower resistance high I/O density short electrical path lower inductance package size nearly same as die |
| https://www.w3.org/2000/01/rdf-schema#label |
CSP (Chip Scale Package)
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
gptkb:consumer_electronics
microcontrollers mobile devices integrated circuits memory chips |
| gptkbp:bfsParent |
gptkb:BGA_packages
|
| gptkbp:bfsLayer |
7
|