Statements (27)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
abbreviation
|
| gptkbp:advantage |
improved performance
space saving reduced time to market |
| gptkbp:application |
IoT devices
mobile devices wearable electronics |
| gptkbp:contains |
gptkb:MEMS
sensors integrated circuits passive components |
| gptkbp:describes |
A System in Package (SiP) is an integrated circuit package that contains multiple integrated circuits and passive components in a single package.
|
| gptkbp:field |
electronics
semiconductors |
| https://www.w3.org/2000/01/rdf-schema#label |
SiP
|
| gptkbp:manufacturer |
gptkb:ASE_Group
gptkb:Amkor_Technology gptkb:TSMC |
| gptkbp:relatedTo |
gptkb:microprocessor
gptkb:Multi-Chip_Module |
| gptkbp:standsFor |
System in Package
|
| gptkbp:usedIn |
gptkb:Apple_Watch
smartphones wireless communication modules |
| gptkbp:bfsParent |
gptkb:nRF91_Series
gptkb:System_in_Package_(SiP) |
| gptkbp:bfsLayer |
6
|