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gptkbp:instanceOf
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Electronic packaging technology
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gptkbp:abbreviation
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gptkb:SiP
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gptkbp:advantage
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Flexibility in design
Lower development cost
Shorter time-to-market
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gptkbp:alternativeTo
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gptkb:microprocessor
|
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gptkbp:application
|
gptkb:consumer_electronics
gptkb:Internet_of_Things
Automotive electronics
Mobile devices
Wearable electronics
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gptkbp:component
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gptkb:Die
Substrate
Encapsulation
Bond wires
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gptkbp:contains
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gptkb:MEMS
Sensors
Integrated circuits
Passive components
|
|
gptkbp:enables
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Integration of multiple ICs
Miniaturization of electronic systems
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|
gptkbp:feature
|
Small form factor
High performance
Improved reliability
Heterogeneous integration
Reduced power consumption
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https://www.w3.org/2000/01/rdf-schema#label
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System-in-Package
|
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gptkbp:introducedIn
|
1990s
|
|
gptkbp:manufacturer
|
gptkb:ASE_Group
gptkb:Amkor_Technology
gptkb:TSMC
gptkb:JCET_Group
|
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gptkbp:relatedTo
|
gptkb:Multi-Chip_Module
gptkb:Package-on-Package
gptkb:3D_IC
|
|
gptkbp:standardizedBy
|
gptkb:JEDEC
|
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gptkbp:usedIn
|
Electronics
Semiconductor industry
|
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gptkbp:bfsParent
|
gptkb:Hybrid_Circuits
|
|
gptkbp:bfsLayer
|
6
|