Statements (46)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Electronic Component
|
| gptkbp:advantage |
Compact Size
Complex Manufacturing Higher Cost Improved Performance Limited Mass Production Thermal Management |
| gptkbp:alternativeTo |
Printed Circuit Boards
Monolithic Integrated Circuits |
| gptkbp:application |
gptkb:Signal_Processing
Amplifiers Oscillators Power Supplies |
| gptkbp:consistsOf |
Semiconductor Devices
Active Components Passive Components |
| gptkbp:developedBy |
1960s
|
| gptkbp:fabricationProcess |
Thick Film Technology
Thin Film Technology |
| gptkbp:feature |
Custom Design
High Performance High Reliability Miniaturization |
| https://www.w3.org/2000/01/rdf-schema#label |
Hybrid Circuits
|
| gptkbp:mayInclude |
Capacitors
Inductors Resistors Diodes Transistors Integrated Circuits |
| gptkbp:relatedTo |
gptkb:System-in-Package
gptkb:Surface_Mount_Technology Microelectronics Electronic Packaging |
| gptkbp:requires |
Encapsulation
Bonding Wires Substrate Material |
| gptkbp:substrate |
gptkb:ceramics
gptkb:glass Alumina |
| gptkbp:usedIn |
gptkb:consumer_electronics
Medical Devices Automotive Electronics Military Equipment |
| gptkbp:bfsParent |
gptkb:Microwave_Electronics
|
| gptkbp:bfsLayer |
5
|