Statements (29)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:abbreviation |
PoP
|
| gptkbp:advantage |
improves electrical performance
saves board space |
| gptkbp:allows |
separate logic and memory packages
|
| gptkbp:component |
surface-mount technology
|
| gptkbp:enables |
shorter signal paths
vertical stacking of integrated circuits flexible component combinations |
| gptkbp:feature |
modular assembly
independent package testing reworkability stacked package interconnects |
| https://www.w3.org/2000/01/rdf-schema#label |
Package-on-Package
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:relatedTo |
gptkb:Flip_chip
gptkb:Wire_bonding gptkb:3D_IC System in Package Land Grid Array |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedFor |
DRAM stacking
logic-memory integration NAND stacking |
| gptkbp:usedIn |
smartphones
tablets mobile devices |
| gptkbp:bfsParent |
gptkb:System-in-Package
|
| gptkbp:bfsLayer |
7
|