Statements (42)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
integrated circuit technology
|
| gptkbp:alsoKnownAs |
three-dimensional integrated circuit
|
| gptkbp:application |
high-performance computing
industrial equipment mobile devices memory devices |
| gptkbp:challenge |
thermal management
manufacturing complexity testing difficulty yield issues |
| gptkbp:commercialUse |
early 2010s
|
| gptkbp:contrastsWith |
2D IC
|
| gptkbp:enables |
improved performance
lower power consumption vertical stacking of integrated circuits heterogeneous integration shorter interconnects higher device density |
| https://www.w3.org/2000/01/rdf-schema#label |
3D IC
|
| gptkbp:notableCompany |
gptkb:Samsung
gptkb:Intel gptkb:TSMC gptkb:SK_Hynix Micron |
| gptkbp:product |
gptkb:3D_NAND_flash
gptkb:HBM_(High_Bandwidth_Memory) AMD 3D V-Cache Xilinx 3D FPGAs |
| gptkbp:relatedTo |
gptkb:Moore's_Law
chiplet architecture system-in-package 3D packaging |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
semiconductor industry
|
| gptkbp:uses |
wafer bonding
micro-bumps through-silicon vias die stacking |
| gptkbp:bfsParent |
gptkb:2.5D_IC
gptkb:System-in-Package gptkb:Package_on_Package_(PoP) |
| gptkbp:bfsLayer |
7
|