Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
surface-mount packaging technology
|
| gptkbp:advantage |
improved electrical performance
higher pin density better heat dissipation difficult to inspect solder joints requires X-ray inspection difficult to rework |
| gptkbp:alternativeTo |
quad flat package (QFP)
|
| gptkbp:assembly |
pick-and-place machine
reflow oven |
| gptkbp:ballPitch |
varies by package
|
| gptkbp:commonIn |
gptkb:consumer_electronics
industrial equipment computers mobile devices automotive electronics |
| gptkbp:component |
printed circuit boards (PCBs)
|
| gptkbp:failureMode |
solder joint cracking
voids in solder balls |
| gptkbp:feature |
array of solder balls
|
| gptkbp:game |
solder
lead-free solder tin-lead solder |
| gptkbp:hasVariant |
ceramic BGA (CBGA)
chip scale package (CSP) flip-chip BGA (FCBGA) micro BGA (μBGA) plastic BGA (PBGA) tape BGA (TBGA) |
| https://www.w3.org/2000/01/rdf-schema#label |
Ball Grid Array (BGA)
|
| gptkbp:inspectionBody |
X-ray imaging
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:pieceCount |
varies by package
|
| gptkbp:reflowProcess |
solder balls melt during reflow soldering
|
| gptkbp:reliability |
high for thermal cycling
|
| gptkbp:replacedBy |
dual in-line package (DIP)
pin grid array (PGA) |
| gptkbp:reworkMethod |
hot air rework station
|
| gptkbp:solderBallsLocation |
underside of the package
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:type |
surface-mount
chip carrier |
| gptkbp:usedBy |
semiconductor industry
electronics manufacturers |
| gptkbp:usedFor |
integrated circuits
|
| gptkbp:usedIn |
microprocessors
ASICs FPGAs memory devices |
| gptkbp:bfsParent |
gptkb:POP_(package_on_package)
|
| gptkbp:bfsLayer |
6
|