surface mount technology (SMT)
GPTKB entity
Statements (33)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronics manufacturing technology
|
| gptkbp:abbreviation |
gptkb:SMT
|
| gptkbp:became_widespread |
1980s
|
| gptkbp:challenge |
thermal management
inspection of solder joints repair and rework |
| gptkbp:enables |
automated assembly
double-sided PCB assembly higher component density smaller component size |
| https://www.w3.org/2000/01/rdf-schema#label |
surface mount technology (SMT)
|
| gptkbp:introducedIn |
1960s
|
| gptkbp:involves |
inspection and testing
pick-and-place machines reflow soldering solder paste application |
| gptkbp:reduces |
manufacturing cost
assembly time |
| gptkbp:relatedTo |
through-hole technology
ball grid array (BGA) chip-scale package (CSP) pick-and-place machine reflow oven |
| gptkbp:replacedBy |
through-hole technology in many applications
|
| gptkbp:requires |
specialized equipment
|
| gptkbp:used_in |
gptkb:consumer_electronics
medical devices automotive electronics industrial electronics |
| gptkbp:usedFor |
mounting electronic components directly onto PCB surface
|
| gptkbp:uses |
surface-mount devices (SMDs)
|
| gptkbp:bfsParent |
gptkb:Package_on_Package_(PoP)
|
| gptkbp:bfsLayer |
7
|