Statements (43)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic packaging technology
|
| gptkbp:advantage |
flexibility in component selection
shorter development time than SoC |
| gptkbp:alsoKnownAs |
gptkb:SiP
|
| gptkbp:application |
gptkb:consumer_electronics
IoT devices mobile devices automotive electronics wearable electronics |
| gptkbp:challenge |
thermal management
signal integrity manufacturing complexity testing complexity |
| gptkbp:contains |
gptkb:MEMS
sensors integrated circuits passive components other electronic components |
| gptkbp:contrastsWith |
System-on-Chip (SoC)
|
| gptkbp:enables |
customized solutions
faster time-to-market integration of RF and power components integration of analog and digital components integration of multiple ICs in a single package |
| gptkbp:feature |
improved electrical performance
high-density packaging reduced board space heterogeneous integration miniaturization of electronic systems potential for lower cost reduced interconnect length |
| https://www.w3.org/2000/01/rdf-schema#label |
System-in-Package (SiP)
|
| gptkbp:integratesWith |
vertical stacking
side-by-side placement |
| gptkbp:introducedIn |
late 1990s
|
| gptkbp:manufacturer |
various semiconductor companies
|
| gptkbp:relatedTo |
gptkb:Multi-Chip_Module_(MCM)
3D IC packaging Package-on-Package (PoP) |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
semiconductor industry
|
| gptkbp:bfsParent |
gptkb:nRF91_Series
|
| gptkbp:bfsLayer |
6
|