Statements (14)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:benefit |
improved performance
lower power consumption smaller footprint |
| gptkbp:combines |
gptkb:System-in-Package_(SiP)
embedded Package-on-Package (ePoP) |
| gptkbp:enables |
high-density integration
stacking of multiple chips |
| https://www.w3.org/2000/01/rdf-schema#label |
SiP-ePoP
|
| gptkbp:standsFor |
System-in-Package embedded Package-on-Package
|
| gptkbp:usedIn |
smartphones
mobile devices |
| gptkbp:bfsParent |
gptkb:Exynos_7270
|
| gptkbp:bfsLayer |
7
|