Statements (37)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:alternativeTo |
solder bumping
tape automated bonding |
| gptkbp:canBe |
manual
automatic ball bonding wedge bonding |
| gptkbp:connects |
semiconductor chip
package leads |
| gptkbp:failureMode |
corrosion
bond lift wire breakage |
| https://www.w3.org/2000/01/rdf-schema#label |
Wire bonding
|
| gptkbp:inventedBy |
1950s
|
| gptkbp:limitation |
not ideal for very fine pitch devices
not suitable for very high-frequency signals |
| gptkbp:main_methods |
thermocompression bonding
thermosonic bonding ultrasonic bonding |
| gptkbp:replacedBy |
gptkb:flip_chip_technology
|
| gptkbp:requires |
clean surfaces
bonding machine |
| gptkbp:used_in |
power electronics
integrated circuit fabrication MEMS packaging LED packaging microelectronic device assembly |
| gptkbp:usedFor |
electrical interconnection
mechanical interconnection |
| gptkbp:uses |
fine wire
|
| gptkbp:wire_diameter_range |
15–75 micrometers
|
| gptkbp:wire_material |
gptkb:gold
copper aluminum |
| gptkbp:bfsParent |
gptkb:POP_(Package_on_Package)
gptkb:Package-on-Package |
| gptkbp:bfsLayer |
8
|