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gptkbp:instanceOf
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semiconductor packaging technology
|
|
gptkbp:advantage
|
improves electrical performance
saves board space
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|
gptkbp:allows
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separate logic and memory packages to be stacked
|
|
gptkbp:alternativeTo
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gptkb:Multi-Chip_Module_(MCM)
gptkb:System_in_Package_(SiP)
|
|
gptkbp:commonStacking
|
logic chip on bottom, memory chip on top
|
|
gptkbp:component
|
surface-mount technology
|
|
gptkbp:enables
|
shorter signal paths
vertical stacking of integrated circuits
flexibility in sourcing components
higher performance in mobile processors
independent testing of logic and memory packages
lower parasitic inductance
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
POP (Package on Package)
|
|
gptkbp:introducedIn
|
early 2000s
|
|
gptkbp:relatedTo
|
gptkb:Flip_chip
gptkb:Wire_bonding
gptkb:Ball_Grid_Array_(BGA)
|
|
gptkbp:standardizedBy
|
gptkb:JEDEC
|
|
gptkbp:usedBy
|
gptkb:Apple
gptkb:Qualcomm
gptkb:Samsung
|
|
gptkbp:usedFor
|
high-density applications
space-constrained designs
|
|
gptkbp:usedIn
|
smartphones
tablets
mobile devices
|
|
gptkbp:bfsParent
|
gptkb:Texas_Instruments_OMAP_3
gptkb:TI_OMAP_3430
gptkb:Texas_Instruments_OMAP_5430
gptkb:OMAP4430
gptkb:OMAP4460
gptkb:OMAP4470
gptkb:Texas_Instruments_OMAP_3630
gptkb:Texas_Instruments_OMAP3530
gptkb:Texas_Instruments_OMAP3
|
|
gptkbp:bfsLayer
|
7
|