Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
surface-mount packaging technology
|
| gptkbp:abbreviation |
BGA
|
| gptkbp:advantage |
improved electrical performance
better heat dissipation difficult to inspect solder joints requires X-ray inspection |
| gptkbp:component |
printed circuit board assemblies
|
| gptkbp:feature |
surface-mount technology
array of solder balls high pin density |
| https://www.w3.org/2000/01/rdf-schema#label |
ball grid array
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:mounting_method |
reflow soldering
|
| gptkbp:relatedTo |
land grid array
chip-scale package quad flat package |
| gptkbp:replacedBy |
dual in-line package
pin grid array |
| gptkbp:usedFor |
microprocessors
integrated circuits memory chips |
| gptkbp:bfsParent |
gptkb:NanoBGA2
|
| gptkbp:bfsLayer |
7
|