|
gptkbp:instanceOf
|
gptkb:Integrated_Circuit_Package
|
|
gptkbp:abbreviation
|
QFP
|
|
gptkbp:advantage
|
Compact size
Good for automated assembly
High pin count
|
|
gptkbp:developedBy
|
1980s
|
|
gptkbp:hasDrawback
|
Difficult to solder manually
Leads are fragile
|
|
gptkbp:hasLeadPitch
|
0.4 mm to 1.0 mm
|
|
gptkbp:hasLeadType
|
Gull wing
|
|
gptkbp:hasPinCountRange
|
32 to 304
|
|
gptkbp:hasPinsOn
|
Four sides
|
|
gptkbp:hasThermalPerformance
|
Moderate
|
|
gptkbp:hasVariant
|
gptkb:Low-profile_Quad_Flat_Package
gptkb:Thin_Quad_Flat_Package
Plastic Quad Flat Package
|
|
gptkbp:material
|
gptkb:ceramics
Plastic
|
|
gptkbp:replacedBy
|
gptkb:Land_Grid_Array
|
|
gptkbp:shape
|
Rectangular
|
|
gptkbp:standardizedBy
|
gptkb:JEDEC
|
|
gptkbp:type
|
Surface-mount
|
|
gptkbp:usedFor
|
Microprocessors
Microcontrollers
Surface-mount technology
Application-specific integrated circuits
|
|
gptkbp:usedIn
|
Electronics
|
|
gptkbp:bfsParent
|
gptkb:Dual_In-line_Package
gptkb:Low-profile_Quad_Flat_Package
gptkb:Ball_Grid_Array_packages
gptkb:QFP_packages
gptkb:Thin_Quad_Flat_Package
|
|
gptkbp:bfsLayer
|
8
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Quad Flat Package
|