Statements (31)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Integrated Circuit Package
|
| gptkbp:abbreviation |
QFP
|
| gptkbp:advantage |
Compact size
Good for automated assembly High pin count |
| gptkbp:developedBy |
1980s
|
| gptkbp:hasDrawback |
Difficult to solder manually
Leads are fragile |
| gptkbp:hasLeadPitch |
0.4 mm to 1.0 mm
|
| gptkbp:hasLeadType |
Gull wing
|
| gptkbp:hasPinCountRange |
32 to 304
|
| gptkbp:hasPinsOn |
Four sides
|
| gptkbp:hasThermalPerformance |
Moderate
|
| gptkbp:hasVariant |
gptkb:Low-profile_Quad_Flat_Package
gptkb:Thin_Quad_Flat_Package Plastic Quad Flat Package |
| https://www.w3.org/2000/01/rdf-schema#label |
Quad Flat Package
|
| gptkbp:material |
gptkb:ceramics
Plastic |
| gptkbp:replacedBy |
Land Grid Array
|
| gptkbp:shape |
Rectangular
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:type |
Surface-mount
|
| gptkbp:usedFor |
Microprocessors
Microcontrollers Surface-mount technology Application-specific integrated circuits |
| gptkbp:usedIn |
Electronics
|
| gptkbp:bfsParent |
gptkb:Dual_In-line_Package
gptkb:Low-profile_Quad_Flat_Package |
| gptkbp:bfsLayer |
7
|