Properties (57)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Electronic Component
|
| gptkbp:canBe |
Yes
|
| gptkbp:category |
Surface mount technology
Through-hole technology Ball grid array Chip-on-board Dual in-line package Quad flat package Leadless_chip_carrier |
| gptkbp:facilitates |
Electrical connections
|
| gptkbp:hasFunction |
Encapsulate integrated circuits
|
| https://www.w3.org/2000/01/rdf-schema#label |
Integrated Circuit Package
|
| gptkbp:includes |
Lead frames
Bond_wires |
| gptkbp:isAssociatedWith |
Mechanical stress
Thermal cycling Moisture sensitivity |
| gptkbp:isAvailableIn |
Various sizes
Various shapes |
| gptkbp:isDesignedFor |
Thermal management
Signal integrity |
| gptkbp:isFundedBy |
Semiconductor companies
|
| gptkbp:isInfluencedBy |
Technological advancements
Market demand Regulatory requirements Cost considerations |
| gptkbp:isPartOf |
Integrated circuits
Electronic systems |
| gptkbp:isSubjectTo |
Environmental assessments
Quality control processes Standards and regulations Testing protocols |
| gptkbp:isTestedFor |
Performance
Reliability Compatibility |
| gptkbp:isUsedFor |
Communication systems
Control systems Signal processing Data storage Embedded systems Power management Mixed-signal applications Analog_applications Digital_applications |
| gptkbp:isUsedIn |
Consumer electronics
Mobile devices Computers Industrial equipment Automotive_applications |
| gptkbp:isVisitedBy |
High-frequency applications
High-speed applications High-density applications Low-power applications |
| gptkbp:madeOf |
Ceramic
Metal Plastic |
| gptkbp:provides |
Protection from physical damage
|