Statements (18)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Land Grid Array
|
| gptkbp:advantage |
improved electrical performance
high density interconnect |
| gptkbp:application |
integrated circuits
|
| gptkbp:feature |
gptkb:flip_chip_technology
solder balls on underside |
| https://www.w3.org/2000/01/rdf-schema#label |
FCBGA
|
| gptkbp:relatedTo |
gptkb:FCBGA_package
BGA |
| gptkbp:standsFor |
gptkb:Flip_Chip_Ball_Grid_Array
|
| gptkbp:usedIn |
semiconductor packaging
|
| gptkbp:bfsParent |
gptkb:Exynos_7420
gptkb:Microchip_PolarFire_SoC gptkb:Apple_A8X gptkb:Apple_A9 gptkb:Apple_A9X gptkb:Intel_Atom_Z540 |
| gptkbp:bfsLayer |
6
|