Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
wire bond BGA
|
| gptkbp:assembly |
flip chip bonding
|
| gptkbp:contrastsWith |
BGA package
|
| gptkbp:hasComponent |
substrate
solder balls silicon die |
| gptkbp:hasFeature |
gptkb:ball_grid_array
flip chip die attachment |
| https://www.w3.org/2000/01/rdf-schema#label |
FCBGA package
|
| gptkbp:provides |
good electrical performance
good thermal performance high I/O density |
| gptkbp:standsFor |
gptkb:Flip_Chip_Ball_Grid_Array
|
| gptkbp:type |
surface mount
|
| gptkbp:usedBy |
gptkb:AMD
gptkb:NVIDIA gptkb:Intel |
| gptkbp:usedFor |
high-performance ICs
|
| gptkbp:usedIn |
microprocessors
ASICs FPGAs |
| gptkbp:bfsParent |
gptkb:FCBGA
|
| gptkbp:bfsLayer |
7
|