Statements (36)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:abbreviation |
gptkb:FCBGA
|
| gptkbp:advantage |
improved electrical performance
better heat dissipation smaller package size |
| gptkbp:application |
gptkb:consumer_electronics
high-performance computing networking devices |
| gptkbp:component |
substrate
solder balls underfill material semiconductor die |
| gptkbp:enables |
compact device design
faster signal transmission higher pin count |
| gptkbp:feature |
solder balls on underside
good thermal performance flip chip die attachment high I/O density short electrical path |
| https://www.w3.org/2000/01/rdf-schema#label |
Flip Chip Ball Grid Array
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:manufacturer |
gptkb:ASE_Group
gptkb:AMD gptkb:Intel gptkb:TSMC |
| gptkbp:relatedTo |
gptkb:Chip_Scale_Package
Land Grid Array Flip Chip |
| gptkbp:replacedBy |
Pin Grid Array
Wire Bonding Package |
| gptkbp:usedIn |
microprocessors
integrated circuits graphics processing units |
| gptkbp:bfsParent |
gptkb:FCBGA
|
| gptkbp:bfsLayer |
7
|