Statements (20)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:alternativeTo |
wire bonding
|
| gptkbp:developedBy |
gptkb:IBM
|
| gptkbp:enables |
better electrical performance
improved heat dissipation direct electrical connection of chip to substrate higher input/output density smaller package size |
| https://www.w3.org/2000/01/rdf-schema#label |
flip chip technology
|
| gptkbp:introducedIn |
1960s
|
| gptkbp:requires |
underfill material
|
| gptkbp:usedIn |
microprocessors
integrated circuits graphics processing units MEMS devices high-frequency applications |
| gptkbp:uses |
solder bumps
|
| gptkbp:bfsParent |
gptkb:TSV_(Through-Silicon_Via)
gptkb:FCBGA |
| gptkbp:bfsLayer |
7
|