Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Semiconductor package
|
| gptkbp:abbreviation |
gptkb:CSP
|
| gptkbp:application |
gptkb:consumer_electronics
Microprocessors Mobile devices Memory devices |
| gptkbp:developedBy |
1990s
|
| gptkbp:feature |
High performance
Surface-mount technology Low profile Short electrical path Size close to die size |
| https://www.w3.org/2000/01/rdf-schema#label |
Chip Scale Package
|
| gptkbp:relatedTo |
Land Grid Array
Quad Flat No-lead package Wafer Level Chip Scale Package |
| gptkbp:requires |
Package area ≤ 1.2x die area
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:type |
Miniaturized package
Surface-mount package |
| gptkbp:usedIn |
Integrated circuits
|
| gptkbp:bfsParent |
gptkb:Ultra_Fine-pitch_Ball_Grid_Array
gptkb:NanoBGA2 |
| gptkbp:bfsLayer |
7
|