TSMC N3E process

GPTKB entity

Statements (23)
Predicate Object
gptkbp:instanceOf semiconductor manufacturing process
gptkbp:announced 2022
gptkbp:developedBy gptkb:TSMC
gptkbp:feature improved performance
lower power consumption
higher yield
fewer EUV layers than N3
better process window
https://www.w3.org/2000/01/rdf-schema#label TSMC N3E process
gptkbp:improves TSMC N3 process
gptkbp:massProductionStart 2023
gptkbp:notableClient gptkb:Apple
gptkb:AMD
gptkb:Qualcomm
gptkb:Intel
gptkbp:successor gptkb:TSMC_N5_process
gptkbp:target mobile devices
high performance computing
gptkbp:technology 3nm
gptkbp:uses gptkb:FinFET
gptkbp:variant TSMC N3 process
gptkbp:bfsParent gptkb:TSMC_N3B_process
gptkbp:bfsLayer 7