Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:semiconductor_manufacturing_process
|
| gptkbp:announced |
2022
|
| gptkbp:developedBy |
gptkb:TSMC
|
| gptkbp:feature |
improved performance
lower power consumption higher yield fewer EUV layers than N3 better process window |
| gptkbp:improves |
TSMC N3 process
|
| gptkbp:massProductionStart |
2023
|
| gptkbp:notableClient |
gptkb:Apple
gptkb:AMD gptkb:Qualcomm gptkb:Intel |
| gptkbp:successor |
gptkb:TSMC_N5_process
|
| gptkbp:target |
mobile devices
high performance computing |
| gptkbp:technology |
3nm
|
| gptkbp:uses |
gptkb:FinFET
|
| gptkbp:variant |
TSMC N3 process
|
| gptkbp:bfsParent |
gptkb:TSMC_N3B_process
|
| gptkbp:bfsLayer |
8
|
| https://www.w3.org/2000/01/rdf-schema#label |
TSMC N3E process
|