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gptkbp:instanceOf
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semiconductor process node
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gptkbp:announced
|
2019
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gptkbp:competitor
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gptkb:Samsung_5nm
gptkb:Intel_7
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gptkbp:designRule
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EUV-based
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gptkbp:developedBy
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gptkb:TSMC
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gptkbp:EUVLithography
|
used
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gptkbp:fullName
|
gptkb:TSMC_N5
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|
https://www.w3.org/2000/01/rdf-schema#label
|
TSMC 5nm
|
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gptkbp:locationOfFabs
|
gptkb:Taiwan
gptkb:Arizona,_USA
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|
gptkbp:marketLaunch
|
2020
|
|
gptkbp:massProductionStart
|
April 2020
|
|
gptkbp:notableClient
|
gptkb:Apple
gptkb:AMD
gptkb:Qualcomm
gptkb:MediaTek
|
|
gptkbp:performanceImprovementOver7nm
|
15%
|
|
gptkbp:powerEfficiencyImprovementOver7nm
|
30%
|
|
gptkbp:predecessor
|
gptkb:TSMC_7nm
|
|
gptkbp:processNode
|
5 nanometers
|
|
gptkbp:successor
|
gptkb:TSMC_3nm
|
|
gptkbp:technology
|
gptkb:FinFET
|
|
gptkbp:transistorDensity
|
171.3 million transistors per mm²
|
|
gptkbp:usedIn
|
gptkb:Apple_A14_Bionic
gptkb:Apple_M1
gptkb:Apple_M2
gptkb:Apple_A15_Bionic
gptkb:Snapdragon_8_Gen_1
gptkb:MediaTek_Dimensity_9000
|
|
gptkbp:waferDiameter
|
300 mm
|
|
gptkbp:bfsParent
|
gptkb:AMD_Ryzen_7000_CPUs
|
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gptkbp:bfsLayer
|
6
|