Statements (63)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic assembly technology
|
| gptkbp:abbreviation |
gptkb:SMT
|
| gptkbp:advantage |
thermal management challenges
higher reliability difficult manual repair difficult prototyping faster assembly lower manufacturing cost |
| gptkbp:becameMainstream |
1980s
|
| gptkbp:category |
electronics manufacturing
PCB assembly |
| gptkbp:component |
gptkb:microprocessor
transistor capacitor resistor surface-mount device |
| gptkbp:componentPackageType |
gptkb:TSOP
gptkb:SMC gptkb:SMD gptkb:LGA gptkb:CSP gptkb:PLCC gptkb:SOIC gptkb:DFN TO QFP SON SOT SOP BGA QFN TQFP MELF SMT capacitor SMT resistor |
| gptkbp:enables |
automated assembly
higher component density smaller component size |
| https://www.w3.org/2000/01/rdf-schema#label |
Surface-Mount Technology
|
| gptkbp:introducedIn |
1960s
|
| gptkbp:involves |
gptkb:investigation
testing pick-and-place machines reflow soldering solder paste |
| gptkbp:relatedStandard |
gptkb:IPC-7351
gptkb:IPC-A-610 J-STD-001 |
| gptkbp:relatedTo |
X-ray inspection
automated optical inspection reflow soldering pick-and-place automation selective soldering wave soldering |
| gptkbp:replacedBy |
through-hole technology in many applications
|
| gptkbp:usedFor |
mounting electronic components directly onto PCB surface
|
| gptkbp:usedIn |
gptkb:consumer_electronics
industrial equipment medical devices automotive electronics industrial electronics |
| gptkbp:bfsParent |
gptkb:Through-Hole_Technology
|
| gptkbp:bfsLayer |
7
|