|
gptkbp:instanceOf
|
gptkb:standard
|
|
gptkbp:appliesTo
|
printed circuit board assemblies
surface mount assemblies
through-hole assemblies
|
|
gptkbp:category
|
electronics manufacturing
|
|
gptkbp:certification
|
gptkb:CIS_(Certified_IPC_Specialist)
gptkb:CIT_(Certified_IPC_Trainer)
yes
MIT (Master IPC Trainer)
|
|
gptkbp:defines
|
acceptance criteria for soldered electrical and electronic assemblies
|
|
gptkbp:firstPublished
|
1983
|
|
gptkbp:focusesOn
|
acceptability of electronic assemblies
|
|
gptkbp:fullName
|
gptkb:IPC-A-610_Acceptability_of_Electronic_Assemblies
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
IPC-A-610
|
|
gptkbp:language
|
English
|
|
gptkbp:latestReleaseVersion
|
gptkb:IPC-A-610H
2020
|
|
gptkbp:publishedBy
|
gptkb:IPC
|
|
gptkbp:region
|
international
|
|
gptkbp:relatedStandard
|
gptkb:IPC-A-620
gptkb:IPC_J-STD-001
|
|
gptkbp:status
|
active
|
|
gptkbp:translatedInto
|
gptkb:Chinese
gptkb:French
gptkb:German
|
|
gptkbp:usedBy
|
electronics manufacturing industry
|
|
gptkbp:usedFor
|
inspection of electronic assemblies
training and certification
|
|
gptkbp:bfsParent
|
gptkb:Surface_Mount_Equipment
gptkb:IPC_certification
|
|
gptkbp:bfsLayer
|
6
|