Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:Electronics_Manufacturing_Technology
|
| gptkbp:abbreviation |
gptkb:THT
|
| gptkbp:advantage |
Higher Cost
Larger Board Space Slower Assembly Strong Mechanical Bond |
| gptkbp:component |
Axial Lead
Radial Lead |
| gptkbp:contrastsWith |
gptkb:Surface-Mount_Technology
|
| gptkbp:introducedIn |
1950s
|
| gptkbp:involves |
gptkb:Leaded_Components
Soldering Drilled Holes |
| gptkbp:replacedBy |
gptkb:Surface-Mount_Technology
|
| gptkbp:requires |
Manual Assembly
Wave Soldering |
| gptkbp:usedFor |
gptkb:Aerospace_Electronics
Prototyping Military Electronics High-Reliability Applications |
| gptkbp:usedIn |
gptkb:Printed_Circuit_Board_Assembly
|
| gptkbp:bfsParent |
gptkb:Surface_Mount_Equipment
|
| gptkbp:bfsLayer |
6
|
| https://www.w3.org/2000/01/rdf-schema#label |
Through-Hole Technology
|