Statements (24)
Predicate | Object |
---|---|
gptkbp:instanceOf |
Electronics Manufacturing Technology
|
gptkbp:abbreviation |
gptkb:THT
|
gptkbp:advantage |
Higher Cost
Larger Board Space Slower Assembly Strong Mechanical Bond |
gptkbp:component |
Axial Lead
Radial Lead |
gptkbp:contrastsWith |
gptkb:Surface-Mount_Technology
|
https://www.w3.org/2000/01/rdf-schema#label |
Through-Hole Technology
|
gptkbp:introducedIn |
1950s
|
gptkbp:involves |
gptkb:Leaded_Components
Soldering Drilled Holes |
gptkbp:replacedBy |
gptkb:Surface-Mount_Technology
|
gptkbp:requires |
Manual Assembly
Wave Soldering |
gptkbp:usedFor |
gptkb:Aerospace_Electronics
Prototyping Military Electronics High-Reliability Applications |
gptkbp:usedIn |
gptkb:Printed_Circuit_Board_Assembly
|
gptkbp:bfsParent |
gptkb:Surface_Mount_Equipment
|
gptkbp:bfsLayer |
6
|