Through-Hole Technology

GPTKB entity

Statements (24)
Predicate Object
gptkbp:instanceOf Electronics Manufacturing Technology
gptkbp:abbreviation gptkb:THT
gptkbp:advantage Higher Cost
Larger Board Space
Slower Assembly
Strong Mechanical Bond
gptkbp:component Axial Lead
Radial Lead
gptkbp:contrastsWith gptkb:Surface-Mount_Technology
https://www.w3.org/2000/01/rdf-schema#label Through-Hole Technology
gptkbp:introducedIn 1950s
gptkbp:involves gptkb:Leaded_Components
Soldering
Drilled Holes
gptkbp:replacedBy gptkb:Surface-Mount_Technology
gptkbp:requires Manual Assembly
Wave Soldering
gptkbp:usedFor gptkb:Aerospace_Electronics
Prototyping
Military Electronics
High-Reliability Applications
gptkbp:usedIn gptkb:Printed_Circuit_Board_Assembly
gptkbp:bfsParent gptkb:Surface_Mount_Equipment
gptkbp:bfsLayer 6