Statements (31)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
difficult for manual soldering
fragile leads good for high-density PCB design suitable for automated assembly |
| gptkbp:feature |
compact size
thin body quad sides leads |
| gptkbp:hasLeads |
gull-wing
|
| https://www.w3.org/2000/01/rdf-schema#label |
TQFP packages
|
| gptkbp:leadCountRange |
32 to 256
|
| gptkbp:leadPitch |
0.5 mm
0.4 mm 0.8 mm |
| gptkbp:relatedTo |
gptkb:LQFP_packages
gptkb:QFP_packages gptkb:VQFP_packages |
| gptkbp:shape |
rectangular
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:standsFor |
gptkb:Thin_Quad_Flat_Package
|
| gptkbp:thickness |
1.4 mm
1.0 mm 1.0 to 1.4 mm |
| gptkbp:type |
gptkb:plastic
surface-mount |
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
microcontrollers
ASICs FPGAs |
| gptkbp:bfsParent |
gptkb:Infineon_XMC
|
| gptkbp:bfsLayer |
6
|