Printed Circuit Board Assembly
GPTKB entity
Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Manufacturing process
|
| gptkbp:abbreviation |
PCBA
|
| gptkbp:alternativeName |
PCBA
|
| gptkbp:hasFeature |
gptkb:RoHS
gptkb:REACH gptkb:ISO_9001 gptkb:IPC-A-610 IPC-7711/7721 J-STD-001 |
| https://www.w3.org/2000/01/rdf-schema#label |
Printed Circuit Board Assembly
|
| gptkbp:mayInclude |
Conformal coating
Double-sided assembly Lead-free soldering Mixed technology assembly Potting |
| gptkbp:performedBy |
Contract manufacturer
Original equipment manufacturer |
| gptkbp:processor |
Testing
Inspection Surface-mount technology Through-hole technology Component placement Reflow soldering Solder paste printing |
| gptkbp:qualityControl |
X-ray inspection
Automated optical inspection Functional testing |
| gptkbp:relatedTo |
gptkb:Printed_Circuit_Board
Electronics manufacturing |
| gptkbp:requires |
Electronic components
Assembly line Solder Printed circuit board |
| gptkbp:riskFactor |
Cold solder joint
Component misplacement Electrostatic discharge damage Solder bridging Tombstoning |
| gptkbp:step |
Cleaning
Pick and place Final inspection Manual soldering Solder paste application Wave soldering |
| gptkbp:usedIn |
gptkb:consumer_electronics
industrial equipment Aerospace Medical devices Automotive electronics |
| gptkbp:bfsParent |
gptkb:Through-Hole_Technology
|
| gptkbp:bfsLayer |
7
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