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gptkbp:instance_of
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gptkb:Company
|
|
gptkbp:bfsLayer
|
5
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|
gptkbp:bfsParent
|
gptkb:Intel_Xe_architecture
|
|
gptkbp:aims_to
|
gptkb:benchmark
power efficiency
|
|
gptkbp:based_on
|
Super Fin technology
|
|
gptkbp:competes_with
|
AMD 7nm process
|
|
gptkbp:developed_by
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gptkb:Intel_Corporation
|
|
gptkbp:enables
|
AI workloads
|
|
gptkbp:features
|
improved transistor performance
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel 10nm Super Fin process
|
|
gptkbp:improves
|
clock speeds
transistor density
|
|
gptkbp:introduced
|
gptkb:2020
|
|
gptkbp:is_challenged_by
|
manufacturing complexities
|
|
gptkbp:is_compared_to
|
gptkb:TSMC_5nm_process
gptkb:Samsung_8nm_process
|
|
gptkbp:is_considered_as
|
a significant advancement
a key technology for Intel
|
|
gptkbp:is_critical_for
|
Intel's market position
|
|
gptkbp:is_designed_for
|
high-performance applications
|
|
gptkbp:is_evaluated_by
|
performance metrics
scalability
cost efficiency
industry analysts
yield rates
|
|
gptkbp:is_expected_to
|
drive innovation in computing
|
|
gptkbp:is_influenced_by
|
market demands
|
|
gptkbp:is_known_for
|
improved thermal performance
advanced manufacturing techniques
enhanced power efficiency
high transistor performance
|
|
gptkbp:is_optimized_for
|
gptkb:smartphone
data centers
|
|
gptkbp:is_part_of
|
gptkb:Intel's_10nm_technology_family
gptkb:Intel's_10nm_node
Intel's process technology roadmap
Intel's competitive strategy
Intel's future technology plans
|
|
gptkbp:is_supported_by
|
Intel's research and development
|
|
gptkbp:is_used_in
|
gptkb:Intel_Core_processors
gptkb:Intel_Xe_graphics
|
|
gptkbp:is_utilized_in
|
gptkb:Intel_Tiger_Lake_processors
gptkb:Intel_Rocket_Lake_processors
gptkb:Intel_Meteor_Lake_processors
gptkb:Intel_Alder_Lake_processors
gptkb:Intel_Sapphire_Rapids_processors
|
|
gptkbp:manufacturer
|
D1 X facility
|
|
gptkbp:reduces
|
power consumption
|
|
gptkbp:successor
|
Intel 14nm process
|
|
gptkbp:supports
|
high-performance computing
|
|
gptkbp:uses
|
gptkb:financial_services_company
|