Statements (26)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:Company
|
| gptkbp:developed_by |
gptkb:TSMC
|
| gptkbp:enables |
high-performance computing
|
| https://www.w3.org/2000/01/rdf-schema#label |
TSMC 5nm process
|
| gptkbp:is_compatible_with |
gptkb:financial_technology
|
| gptkbp:is_expected_to_be_used_in |
automotive applications
|
| gptkbp:is_known_for |
lowering chip costs
|
| gptkbp:is_manufactured_on |
300mm wafers
|
| gptkbp:is_part_of |
N5 technology node
|
| gptkbp:is_used_in |
gptkb:smartphone
high-end processors |
| gptkbp:key_concept |
gptkb:Io_T_devices
data centers AI applications high-performance graphics 5 G applications |
| gptkbp:offers |
higher transistor density
|
| gptkbp:provides |
improved power efficiency
|
| gptkbp:released_in |
gptkb:2018
|
| gptkbp:successor |
gptkb:TSMC_7nm_process
|
| gptkbp:supports |
3 D stacking technology
|
| gptkbp:uses |
Extreme Ultraviolet Lithography (EUV)
|
| gptkbp:bfsParent |
gptkb:Intel_10nm_Super_Fin_process
gptkb:TSMC_7nm_process gptkb:NVIDIA_Hopper |
| gptkbp:bfsLayer |
8
|