Statements (78)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:Company
|
| gptkbp:aims_to_improve |
performance per watt
|
| gptkbp:challenges |
delays in production
|
| gptkbp:competes_with |
7nm process technology
|
| gptkbp:designed_for |
gptkb:mobile_devices
|
| gptkbp:developed_by |
gptkb:Intel_Corporation
cutting-edge technology collaboration from partners next-generation applications |
| gptkbp:enables |
better thermal management
|
| gptkbp:enhances |
security features
|
| gptkbp:features |
higher transistor density
improved power efficiency |
| gptkbp:has_impact_on |
gaming performance
|
| https://www.w3.org/2000/01/rdf-schema#label |
Intel's 10nm node
|
| gptkbp:impact |
PC market
|
| gptkbp:improves |
graphics performance
|
| gptkbp:includes |
new architecture
Super Fin technology |
| gptkbp:introduced_in |
gptkb:2018
|
| gptkbp:is_analyzed_in |
research institutions
cost efficiency |
| gptkbp:is_challenged_by |
manufacturing complexities
|
| gptkbp:is_compared_to |
AMD's 7nm process
|
| gptkbp:is_critical_for |
future Intel products
|
| gptkbp:is_evaluated_by |
performance metrics
industry standards scalability industry analysts performance analysts market readiness |
| gptkbp:is_incorporated_in |
various product lines
|
| gptkbp:is_influenced_by |
customer feedback
technological trends |
| gptkbp:is_integrated_with |
new chipset technologies
|
| gptkbp:is_linked_to |
Intel's brand reputation
Intel's competitive edge Intel's future innovations Intel's market positioning |
| gptkbp:is_optimized_for |
gptkb:cloud_computing
|
| gptkbp:is_part_of |
gptkb:Intel's_10th_generation_processors
Intel's process technology roadmap Intel's innovation strategy Intel's technology ecosystem Intel's product portfolio Intel's competitive strategy Intel's future roadmap Intel's long-term vision |
| gptkbp:is_promoted_through |
marketing campaigns
|
| gptkbp:is_regarded_as |
a significant advancement
|
| gptkbp:is_subject_to |
market competition
supply chain dynamics |
| gptkbp:is_supported_by |
advanced materials
global partnerships software optimizations research and development efforts Intel's manufacturing facilities |
| gptkbp:is_tested_for |
energy consumption
real-world scenarios reliability various benchmarks various cooling solutions |
| gptkbp:is_used_in |
data center products
|
| gptkbp:is_utilized_in |
consumer electronics
embedded systems AI accelerators high-performance servers |
| gptkbp:manufacturing_process |
Fin FET
|
| gptkbp:performance |
previous Intel nodes
|
| gptkbp:product |
gptkb:Ice_Lake_processors
|
| gptkbp:related_to |
gptkb:Moore's_Law
|
| gptkbp:requires |
advanced lithography techniques
|
| gptkbp:successor |
Intel's 14nm node
|
| gptkbp:supports |
AI workloads
|
| gptkbp:target_market |
high-performance computing
|
| gptkbp:used_in |
gptkb:Intel_Core_processors
|
| gptkbp:bfsParent |
gptkb:Intel_10nm_Super_Fin_process
|
| gptkbp:bfsLayer |
8
|