Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:SDRAM
|
| gptkbp:announced |
gptkb:JEDEC
2021 |
| gptkbp:dataRate |
6.4 Gbps per pin
|
| gptkbp:feature |
gptkb:TSV_(Through-Silicon_Via)_technology
lower power consumption 3D-stacked DRAM wide I/O interface |
| https://www.w3.org/2000/01/rdf-schema#label |
HBM3 memory
|
| gptkbp:manufacturer |
gptkb:Samsung
gptkb:SK_Hynix Micron |
| gptkbp:maximumBandwidthPerStack |
819 GB/s
|
| gptkbp:maxStackSize |
64 GB
|
| gptkbp:partOf |
gptkb:High_Bandwidth_Memory_family
|
| gptkbp:predecessor |
gptkb:HBM2E_memory
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:HBM3E_memory
|
| gptkbp:usedIn |
gptkb:AI_accelerators
high-performance computing GPUs |
| gptkbp:bfsParent |
gptkb:Nvidia_Hopper
|
| gptkbp:bfsLayer |
6
|