Statements (27)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:memory_technology
|
| gptkbp:announced |
gptkb:JEDEC
2023 |
| gptkbp:application |
data centers
supercomputing AI training |
| gptkbp:feature |
lower power consumption
higher bandwidth than HBM3 increased capacity per stack |
| gptkbp:isA |
gptkb:High_Bandwidth_Memory
|
| gptkbp:manufacturer |
gptkb:SK_hynix
gptkb:Samsung Micron |
| gptkbp:maximumBandwidthPerStack |
over 1.2 TB/s
|
| gptkbp:maxStackSize |
up to 64 GB
|
| gptkbp:memoryType |
gptkb:SDRAM
|
| gptkbp:predecessor |
gptkb:HBM3
|
| gptkbp:stackedDieCount |
up to 12
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:HBM3
|
| gptkbp:usedIn |
gptkb:AI_accelerators
GPUs HPC systems |
| gptkbp:width |
1024 bits
|
| gptkbp:bfsParent |
gptkb:HBM3_memory
|
| gptkbp:bfsLayer |
7
|
| https://www.w3.org/2000/01/rdf-schema#label |
HBM3E memory
|