Statements (25)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:memory_technology
|
| gptkbp:announced |
gptkb:JEDEC
2018 |
| gptkbp:interface_width |
1024 bits
|
| gptkbp:manufacturer |
gptkb:Samsung
gptkb:SK_Hynix Micron |
| gptkbp:maximum_bandwidth_per_stack |
460 GB/s
|
| gptkbp:maximum_capacity_per_stack |
16 GB
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:HBM2_memory
|
| gptkbp:target |
gptkb:machine_learning
data centers supercomputers graphics processing units (GPUs) |
| gptkbp:type |
gptkb:High_Bandwidth_Memory_(HBM)
|
| gptkbp:used_in |
gptkb:AI_accelerators
high-performance computing graphics cards |
| gptkbp:uses |
3D-stacked DRAM
|
| gptkbp:bfsParent |
gptkb:Xe-HPC
gptkb:HBM3_memory gptkb:HBM2_memory |
| gptkbp:bfsLayer |
7
|
| https://www.w3.org/2000/01/rdf-schema#label |
HBM2E memory
|