Statements (55)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:software
|
| gptkbp:bfsLayer |
6
|
| gptkbp:bfsParent |
gptkb:LGA_(Land_Grid_Array)
|
| gptkbp:allows |
heat dissipation capabilities
high-density interconnections size of PCB solder ball reliability |
| gptkbp:benefits |
DIP (Dual In-line Package)
QFP (Quad Flat Package) |
| gptkbp:developed_by |
gptkb:CEO
|
| gptkbp:features |
solder balls
|
| gptkbp:first_introduced |
gptkb:1995
|
| https://www.w3.org/2000/01/rdf-schema#label |
BGA (Ball Grid Array)
|
| gptkbp:improves |
advanced packaging technologies
better thermal interface materials enhanced solder materials |
| gptkbp:is_associated_with |
high manufacturing costs
complex assembly processes |
| gptkbp:is_available_in |
various sizes
|
| gptkbp:is_challenged_by |
environmental regulations
miniaturization trends increased power density |
| gptkbp:is_compatible_with |
lead-free solder
|
| gptkbp:is_designed_for |
high-frequency applications
high-speed applications |
| gptkbp:is_evaluated_by |
reliability testing
thermal resistance electrical performance |
| gptkbp:is_often_used_in |
gptkb:microprocessor
ASI Cs FPG As |
| gptkbp:is_subject_to |
thermal cycling tests
mechanical stress tests |
| gptkbp:is_tested_for |
X-ray inspection
electrical continuity ball shear strength drop impact resistance thermal cycling performance voiding in solder joints |
| gptkbp:is_used_in |
gptkb:hospital
gptkb:Telecommunications_company automotive applications consumer electronics industrial controls |
| gptkbp:manufacturer |
reflow soldering
|
| gptkbp:provides |
better thermal performance
|
| gptkbp:regulates |
JEDEC standards
IPC standards |
| gptkbp:requires |
specialized assembly equipment
|
| gptkbp:sensor |
moisture absorption
|
| gptkbp:suitable_for |
gptkb:XMPP_Extension_Protocol
high-performance computing graphics processing units high pin count devices |
| gptkbp:used_in |
surface mount technology
|