Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
surface-mount packaging technology
|
| gptkbp:advantage |
better electrical performance
higher pin density difficult to inspect solder joints requires X-ray inspection better thermal performance |
| gptkbp:alternativeTo |
chip-scale package (CSP)
quad flat package (QFP) small outline integrated circuit (SOIC) |
| gptkbp:component |
embedded systems
microcontrollers mobile devices memory modules ASICs FPGAs motherboards processors graphics cards |
| gptkbp:developedBy |
electronics industry
|
| gptkbp:feature |
array of solder balls
|
| gptkbp:hasType |
ceramic BGA (CBGA)
micro BGA (μBGA) plastic BGA (PBGA) tape BGA (TBGA) wire-bond BGA flexible BGA (FBGA) flip-chip BGA metal BGA (MBGA) stacked BGA (SBGA) thin BGA (TBGA) |
| https://www.w3.org/2000/01/rdf-schema#label |
BGA (Ball Grid Array)
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:mountingMethod |
reflow soldering
hot air soldering infrared soldering |
| gptkbp:relatedTo |
integrated circuit packaging
printed circuit board (PCB) surface-mount technology (SMT) |
| gptkbp:replacedBy |
dual in-line package (DIP)
pin grid array (PGA) |
| gptkbp:requires |
controlled heating
X-ray inspection for quality control precise alignment specialized rework equipment |
| gptkbp:solderBallsMaterial |
tin-lead alloy
lead-free solder |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedFor |
mounting integrated circuits
|
| gptkbp:usedIn |
electronics
|
| gptkbp:bfsParent |
gptkb:UFBGA
|
| gptkbp:bfsLayer |
6
|